Professional multi-layer PCB design and layout optimized for manufacturability, signal integrity, and thermal performance — from simple 2-layer boards to complex 12+ layer high-speed designs.

Our PCB layout engineers transform your schematics into production-optimized board designs. We handle the full spectrum — from simple 2-layer single-sided boards to complex 8–12 layer high-density interconnect (HDI) designs with controlled impedance routing and blind/buried vias.
We work with industry-standard EDA tools including Altium Designer, KiCad, and Eagle, and deliver fabrication-ready output that any PCB manufacturer can produce. Every design undergoes DRC, signal integrity analysis, and thermal simulation before release.
Whether you're designing a compact wearable, a high-speed digital processor board, or a mixed-signal industrial controller, we ensure your PCB layout meets both electrical performance requirements and manufacturing constraints.
Layout quality directly impacts your product's performance, reliability, and manufacturing yield.
Impedance-controlled routing, length matching, differential pair management, and crosstalk minimization for high-speed digital designs.
Strategic copper pours, thermal vias, and heat sink pad design to keep components within safe operating temperatures.
Design for manufacturability — proper pad sizing, solder mask clearances, panelization, and assembly-friendly component placement.
Space-constrained designs with fine-pitch BGA, QFN packages, and HDI technology for miniaturized products.
Proper analog/digital domain separation, ground plane management, and noise isolation for mixed-signal designs.
RF trace routing, impedance matching networks, antenna keep-out zones, and ground plane optimization for wireless designs.
A systematic approach that ensures first-pass success and eliminates costly re-spins.
Thorough review of your schematic for design intent, component footprints, and electrical constraints before starting layout.
Define layer stackup, board outline, mounting holes, connector placement, and critical component positioning.
Complete trace routing with DRC checks, signal integrity analysis, and design review. Iterative refinement until all constraints are met.
Generate Gerber files, drill files, pick-and-place data, and assembly drawings. Ready for any PCB fabricator worldwide.
We design PCBs from 1-layer to 12+ layers. Most of our industrial and IoT designs are 4–6 layers. For high-speed digital or complex mixed-signal applications, we work with 8–12 layer stackups with controlled impedance.
We primarily work with Altium Designer and KiCad. We can also work with Eagle, OrCAD/Allegro, and PADS. If you have a preferred tool, we'll align with your workflow.
Yes. Provide your schematic in any standard format and we'll handle the PCB layout. We start with a thorough schematic review to catch any issues before layout begins.
Simple 2-layer boards take 3–5 days. Standard 4-layer designs take 1–2 weeks. Complex multi-layer boards with high-speed or RF requirements typically take 2–4 weeks including review cycles.
Yes. We can coordinate directly with your preferred PCB manufacturer or recommend trusted fabrication partners in India and Asia. We handle DFM review feedback and ensure smooth production handoff.
Share your schematic and requirements — we'll respond with a detailed timeline and quote for your PCB design.